Substrate for hybrid IC, hybrid IC using the substrate and its application.

摘要

A substrate for a hybrid IC comprises a substrate (1), a thick film resistor (3) containing glass, formed on the substrate (1), and a thick film conductor (2) at the terminal of the thick film resistor (3). A means for preventing diffusion of the glass from the thick film resistor (3) into the thick film conductor (2) is provided between the thick film resistor (3). This means may be a compound added to the paste used for forming the thick film resistor (3) or may be a paste of metallic powder applied to the terminal of the thick film conductor (2). The thick film conductor (2) has a stable resistance as a thick film microresistor and may be applied to various uses such as cellular radio communication system.