| 摘要 |
PURPOSE:To improve the positional accuracy of a circuit by forming on a stainless plate surface a first conductive layer, an insulating layer, a second conductive layer and viaholes, and superimposing two sets of stainless plates, on which conductor circuits are formed, through a printed wiring board and a prepreg, and removing the stainless plates. CONSTITUTION:A first conductive layer 2 is formed on a surface of a stainless plate 1, on which an insulating layer 3 is in turn formed leaving a viahole formation part on a surface of the first conductive layer, and a surface of the insulating layer 3 is subjected to a roughing treatment. Then, a second conductive layer 6 and a viahole 7 are formed on and through the viahole formation part on the insulating layer 3 surface and the conductive layer 2 surface. And, the conductive layer 6 is etched to form a conductor circuit 9. In succession, two sets of stainless plates 1, on which the conductor circuit 9 has been formed, are superimposed turning inside the surface of the plate, on which the conductor circuit 9 has been formed, through a printed wiring board, on which a circuit has previously been formed, and a prepreg 11, and thereafter the stainless plates are removed to form a laminate plate. Hereby, a treatment in the process is facilitated to improve the positional accuracy of the circuit. |
