| 摘要 |
A compliant pad or work piece for use in bonding the inner leads of integrated circuit devices as a part of a tape automated bonding process. The work piece is constructed of a metallic base layer to which is affixed a compliant pad, a cap support and a cap positioned on said compliant pad surrounding a gas channel which is connected to a source of gas such as nitrogen. A ceramic heat distribution layer is positioned over said gas channel and acts to support the integrated circuit device to be bonded to an associated tape during the tape automated bonding process.
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