发明名称 Process for fabricating three-dimensional, free-standing microstructures
摘要 A sublimable layer is deposited on a substrate, holes are etched through the sublimable layer, a thin-layer structure is deposited on portions of the remaining sublimable layer, and a thick structural support material is deposited to cover the sides and bottoms of the holes and portions of the thin-layer structure. When the sublimable layer is sublimed with the heat, photon enhancement (ultraviolet light) and oxygen purging, a structure is left which consists of a thin layer or layers supported by posts above a substrate.
申请公布号 US4849070(A) 申请公布日期 1989.07.18
申请号 US19880243750 申请日期 1988.09.14
申请人 THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE ARMY 发明人 BLY, VINCENT T.;BRADFORD, ALAN P.;COX, J. THOMAS
分类号 G01L9/00;H01L27/16 主分类号 G01L9/00
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