发明名称 |
Process for fabricating three-dimensional, free-standing microstructures |
摘要 |
A sublimable layer is deposited on a substrate, holes are etched through the sublimable layer, a thin-layer structure is deposited on portions of the remaining sublimable layer, and a thick structural support material is deposited to cover the sides and bottoms of the holes and portions of the thin-layer structure. When the sublimable layer is sublimed with the heat, photon enhancement (ultraviolet light) and oxygen purging, a structure is left which consists of a thin layer or layers supported by posts above a substrate.
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申请公布号 |
US4849070(A) |
申请公布日期 |
1989.07.18 |
申请号 |
US19880243750 |
申请日期 |
1988.09.14 |
申请人 |
THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE ARMY |
发明人 |
BLY, VINCENT T.;BRADFORD, ALAN P.;COX, J. THOMAS |
分类号 |
G01L9/00;H01L27/16 |
主分类号 |
G01L9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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