发明名称 Electrolytically metallized article and processes therefore
摘要 An electrolytically metallized article and process therefore, the process including the steps of electrolytically depositing a metal layer onto a surface of the substrate; and structuring the metal layer to provide regularly distributed openings therein, which openings extend through to the substrate and have an interval between adjacent openings which permits, during any subsequent heat treatment of the metallized substrate, the escape of volatile and volatilizable substances included in the metal layer and the substrate during the electrolyte deposition. The interval between adjacent openings is preferably such that the structured metal layer has no continuous metal portion measured between adjacent openings which exceeds 2 mm.
申请公布号 US4849302(A) 申请公布日期 1989.07.18
申请号 US19870129311 申请日期 1987.11.16
申请人 LICENTIA PATENT-VERWALTUNGS-GMBH 发明人 OSTWALD, ROBERT
分类号 C23C18/16;C04B41/88;C25D5/02;C25D5/48;C25D5/50;H05K1/02;H05K1/03;H05K3/06;H05K3/10;H05K3/18;H05K3/38 主分类号 C23C18/16
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