发明名称 WIRE BONDING DEVICE
摘要 PURPOSE:To accelerate the bonding process by a method wherein a spark dis charge means is formed of a spark electrode comprising an electrode made of a wire and another electrode made of a leading-out terminal to eliminate an exclusive spark electrode. CONSTITUTION:The spark discharge is effected by a spark electrode assuming the end 14 of a wire 1 as one electrode and a leadingout terminal 3 as the other electrode. The grounding potential to a main body device is transferred by a switch 6 while another switch 7 is turned ON to supply the spark discharge potential from a DC power supply 8 to the electrode comprising the wire 1. At this time, the spark discharge is effected between the end 14 of the wire 1 and the leading-out terminal 3 as the other electrode to fuse the end 14 of the wire 1 turning the end 14 into a ball by the surface tension thereof. When the ball bonding end is formed, the bonding head shifts to the next process to start the next ball bonding process. Through these procedures, the bonding process can be accelerated.
申请公布号 JPH01179426(A) 申请公布日期 1989.07.17
申请号 JP19880001351 申请日期 1988.01.08
申请人 OKI ELECTRIC IND CO LTD 发明人 IGUCHI AKIHISA
分类号 H01L21/603;H01L21/60 主分类号 H01L21/603
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