| 摘要 |
PURPOSE:To relax a thermal stress to be exerted on a semiconductor element by a sealing resin by installing a protruding frame, composed of an insulating resin, in the periphery of a semiconductor element mounting part of a lead frame for semiconductor device use constituting a semiconductor device. CONSTITUTION:An insulating resin is formed, by a thermal pressure bonding operation, in peripheral parts 3 of a semiconductor element mounting part 2 of a lead frame 7 for semiconductor device use formed by an alloy-made thin flat sheet constituting a semiconductor device 8; this resin is used as a protruding frame 4; a thermal contraction stress of a resin 5 for semiconductor device sealing use is absorbed mostly by the protruding frame 4 and is not exerted directly on a semiconductor element 6. Accordingly, a deterioration in an electrical characteristic such as a current-amplification factor or the like can be reduced by half; even when a wire 7 for external connection use of the semiconductor element is hung; it is possible to avoid the contact of the wire 7 with the semiconductor element 6. By this setup, a yield can be enhanced. |
