| 摘要 |
PURPOSE:To insertion-mold a ceramic into a resin substrate for matching the thermal expansion coefficient by a method wherein the ceramic with the equivalent thermal expansion coefficient to that of a semiconductor chip is used for a die cavity member to bond the semiconductor chip. CONSTITUTION:A die cavity member 10 is formed of a ceramic such as alumina- glass, mullite, etc., with the equivalent thermal expansion coefficient to that of a semiconductor chip. When the semiconductor chip is silicon, mullite-glass, cordierite glass, mullite, etc., are effective. The ceramic thin sheet type die cavity member 10 together with mold resin is formed into one body on the bottom surface of the die cavity 1. Through these procedures, the thermal expansion coefficient of said ceramic can be matched with that of a semiconductor chip. |
