| 摘要 |
PURPOSE:To easily connect an electrode part of a semiconductor body to a conductor pattern or a grounding part of a package or the like without using a bonding wire by a method wherein a tapered face formed by chamfering at least one side edge of the surface of the semiconductor body is formed and an electrode wiring part is formed along said tapered face. CONSTITUTION:One side edge of the surface side of a semiconductor body 11 is chamfered; a tapered face 11a is formed. An electrode wiring part 12 arranged on the surface side of the semiconductor body 11 is connected to an electrode part of a semiconductor element; one side part is arranged along the tapered face 11a of the semiconductor body 11. The surface of the semiconductor body 11 and the electrode wiring part 12 are covered with a protective film 13 excluding a prescribed region of the electrode wiring part 12 formed on the tapered face 11a. A semiconductor chip 10 of this kind is die-bonded to a bonding region of a substrate 30 such as a package, a lead frame or the like by using a conductive paste 20. During this process, the conductive paste 20 is situated on a conductor pattern or a grounding part on the substrate 30 such as the package or the like, and comes into contact with the electrode wiring part 12 arranged along the tapered face 11a of the semiconductor body 11.
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