| 摘要 |
PURPOSE:To decrease an element in area and an earth potential difference so as to enable the miniaturization of the element in shape and the improvement in performance by a method wherein a signal line pattern formed on the front of a substrate and the whole face earth pattern formed on the rear of the substrate are connected with each other through soldering or the like. CONSTITUTION:A signal line pattern 2 is printed on a substrate 1, a chip condenser 3 is inserted into a connecting hole, and the line pattern 2 and the whole face earth pattern 7 are connected with each other by the use of a solder 5 or the like. An upper electrode 8 of the condenser 3 is connected to the pattern 2 through the intermediary of a solder 9, and the lower electrode 10 is connected with a pattern 7 through the intermediary of a solder 7. Therefore, an earth land can be omitted. |
