| 摘要 |
PURPOSE:To surely volatilize and remove a solvent contained in an electrical connection material and/or an insulating material sandwiched between different circuit boards and a secondary product of a hardening reaction by a method wherein a through hole is made in at least one circuit board coming into contact with a conductive paste or an adhesive. CONSTITUTION:Through holes 13 piercing a circuit board are made in parts where evaporating and drying conductive pastes 3 and/or evaporating and drying adhesives are sandwiched inside a laminated circuit board. Accordingly, a volatile component contained in the evaporating and drying conductive pastes 3 and/or the evaporating and drying adhesives is volatilized efficiently through the through holes 13. By this setup, the evaporating and drying conductive pastes 3 and/or the evaporating and drying adhesives can be dried sufficiently even when the area of a connection part is large or the size of the board is large. |
