| 摘要 |
PURPOSE:To decrease a solder in consumption and enable a uniform double side coating to be done reliably by a method wherein coating is performed with upper and lower rollers. CONSTITUTION:Both upper and lower sides of a board 1 are coated with a molten solder 4 by a coating device 41 through the intermediary of upper and lower rollers, 12 and 13, in a process of conveyance of the etched printed board 1, and the board 1 is conveyed to the following flux applying device 42 almost horizontally. And, solder 4 introduced into spray pipes 55 and 56 is ejected from jet nozzles 57 at the entrance side of the rollers 12 and 13 as solder jets 2 and is made to adhere to the surface of the rollers 12 and 13, and solder coated layer 19s controlled in thickness are formed on both the upper and lower faces of the board 1 through the rotation of the rollers 12 and 13 and a gap adjusting device. |
