| 摘要 |
1. Heat-curable organosol for forming firmly adhering, pore-free and sterilization-resistant coatings, containing a vinyl chloride homopolymer, a phenolic resin, a polyester, a diluent, a catalyst and, if appropriate, conventional additives, characterized in that it contains a) 20 to 50 % by weight of the vinyl chloride homopolymer, b) 1 to 15 % by weight of the phenolic resin, c) 1 to 15 % by weight of an epoxide resin, d) 4 to 20 % by weight of a linear polyester based on aromatic and/or cyclic dicarboxylic acids and e) 25 to 60 % by weight of the diluent. |
