| 摘要 |
PURPOSE:To enhance the electric characteristics by a method wherein the temperature of connecting members comprising a shape storage alloy is raised and lowered to engage the members with a semiconductor substrate or release the members from the substrate. CONSTITUTION:At least two each of engagement members to be engaged with the peripheral part of a semiconductor substrate 1 are connected by connecting members 5, 6 comprising a shape storage alloy. The temperature of the connecting members 5, 6 is controlled by a temperature control means 10 to change the shape of the connecting members 5, 6. The temperature of these connecting members 5, 6 can be controlled by supplying the members 5, 6 with power by, e.g., a voltage impressing means for generating heat. By controlling the temperature of these connecting members 5, 6, the connecting members 5, 6 can be provided with two modes i.e., the holding mode wherein the engagement members are engaged with the peripheral part of the semiconductor substrate 1 to hold the semiconductor substrate 1 and the released mode wherein the engagement members are released from the peripheral part of the semiconductor substrate 1. Through these procedures, the semiconductor substrate 1 can be prevented from being polluted by any fine grains or noxious impurity thereby enabling the title holding jig to be used in a vacuum equipment different from the case of holding the semiconductor substrate by vacuum suction. |
