| 摘要 |
<p>PURPOSE:To prevent bonding wires from breaking thereby manufacturing a semiconductor device in enhanced roliability by a method wherein a gel is blended with a filler. CONSTITUTION:An applicable photoset gel 7 is blended with a filler 8 to control the phototransmissivity of the gel 7. When the surface of the gel 7 blended with the filler 8 is irradiated with light, the gel 7 is to be set but as the light is carried further inward, the light is absorbed into or reflected on or shielded with the filler 8 to change the percentage of irradiation with the light. Consequently, the surface of the gel 7 irradiated with ample light is set rather rapidly but the deeper the layer of the gel 7, the less light reaches there making the deeper layer soft. Through these procedures, the improvement of the resistance to external force (shock, centrifugal force), the decrease in stress on bonding wires 4 resultant from the thermal expansion and contraction of the gel 7 can be assured thereby enhancing the reliability of the semiconductor device.</p> |
