| 摘要 |
PURPOSE:To obtain high bonding strength between high-purity nickel plating and a high melting-point metallic layer, and to hold high solderability by plating the surface of the high melting-point metallic layer composed of tungsten or molybdenum or the like with nickel having high purity and executing coating onto the plating. CONSTITUTION:A tungsten or molybdenum metallic layer 2 is formed onto a ceramic green sheet 1, and sintered, thus acquiring a wet type multilayer ceramic circuit board. High-purity nickel-boron plating 3 is executed onto the surface of the metallic layer 2 at that time, and solder coating 4 is conducted onto the plating 3. High-purity nickel-boron plating in boron content of 1wt.% or less is used as the plating 2. Accordingly, high bonding strength is obtained between the plating 3 and the metallic layer 2, thus holding high solderability. |
