| 摘要 |
PURPOSE:To unnecessitate a coating process of adhesive layer, and increase workability, by bonding a semiconductor chip to a lead frame with an adhesive insulating layer having bonding force on both surfaces. CONSTITUTION:A semiconductor chip 3 is bonded on the upper surface of leads 1C-1H, 1M-1R with an adhesive insulating layer 2, which is constituted of the following three-layer structure; an insulating sheet 2B, an adhesive layer 2A stuck on one surface of the sheet 2B facing the chip 3, and an adhesive layer 2C stuck on the other surface of the insulating sheet 2B facing the leads 1C-1H, 1M-1R. The sheet 2B prevents the deformation and deterioration of insulation of the insulating layer 2. The adhesive layer 2C bonds the sheet 2B to the leads 1C-1H, 1M-1R. A coating process of adhesive layer is unnecessitated, thereby enhancing workability.
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