| 摘要 |
PURPOSE:To improve heat-dissipating properties, and to reduce the dispersion of the brightness of an LED array by mounting an LED chip onto the side face section of a metallic substrate and an LED driver circuit onto a planar section. CONSTITUTION:An insulating layer 3 is formed onto the surface of a metallic substrate 5, and conductor patterns 2 are shaped onto the layer 3. A plurality of LED chips 1 are arranged and placed onto the patterns 2 formed onto the side face sections of the substrate 5. LED driver circuits 4 are placed onto the patterns 2 shaped onto the planar sections of the substrate 5. The chips 1 and the circuits 4 are bonded by the patterns 2. Accordingly, heat-dissipating properties are improved, and the dispersion of the brightness of an LED array is reduced. |
