发明名称 |
Flexible cicuit substrate with electroconductive adhesive layer and its production |
摘要 |
An electroconductive adhesive layer of high molecular weight resin having electroconductive particles disposed therein is electrodeposited selectively on only the electroconductive circuit povided on a flexible circuit substrate. The adhesive layer permits precise bonding of the coated circuit with an identical circuit provided on a second flexible circuit substrate.
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申请公布号 |
US4844784(A) |
申请公布日期 |
1989.07.04 |
申请号 |
US19850808140 |
申请日期 |
1985.12.12 |
申请人 |
SHINTO PAINT CO., LTD. |
发明人 |
SUZUKI, TAMEYUKI;KAMAKURA, TAKURO |
分类号 |
H01B1/20;H01R4/04;H05K1/09;H05K3/24;H05K3/32;H05K3/36 |
主分类号 |
H01B1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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