| 摘要 |
A solder system is adapted for use in soldering the terminals of a plurality of circuit boards, to corresponding leads of a plurality of cables. The solder system includes a holding fixture for supporting adjustably the circuit boards relative to the corresponding cablels. A gripper assembly retains the cable leads in position above the corresponding board terminals. A monitor assembly is utilized to supervise optically the various stages of the soldering process. A heater assembly is mounted adjustably above the holding fixture for reflowing the solder material over the aligned cable leads and board terminals.
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