发明名称 COATED WIRE FOR BONDING SEMICONDUCTOR ELEMENT
摘要 PURPOSE:To improve bondability without reducing insulation by so forming a fluorine resin that the thickness of a coating film becomes a predetermined value. CONSTITUTION:A coated wire A is formed in such a manner that the thickness of a coating film 2 made of fluororesin to coat a metal wire 1 made of metal, aluminum or copper wire is ranged at 0.5-3mum. For example, after the wire 1 made, for example, of high purity copper wire is degreased, the wire 1 is so coated by a roller coating method with vinyl fluoride paint that the thickness of the film becomes 0.5-3mum, and cured to obtain the coated wire A having a fluororesin-coating layer 2 having 0.5-3mum of thickness, i.e., a coated copper wire. Thus, the coated wire having both preferable insulation and bondability can be obtained.
申请公布号 JPH01168036(A) 申请公布日期 1989.07.03
申请号 JP19870328010 申请日期 1987.12.23
申请人 TANAKA ELECTRON IND CO LTD 发明人 SHIRAKAWA SHINJI;IGA SUKEHITO
分类号 H01L21/60 主分类号 H01L21/60
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