INSPECTING METHOD FOR CONNECTION STATE OF ELECTRONIC COMPONENT LEAD

摘要

PURPOSE:To easily detect a part poor in solder connection with high accuracy by extracting an impact sound generated when a detection rod is brought into contact with a lead wire on a solder connection pad and then moved. CONSTITUTION:The detection rod 11 is moved in a constant direction at a prescribed speed on the lead wire 5 soldered onto the semiconductor connection pad 2 of a printed board 1. A vibration sound generated between the detection rod 11 and lead wire is detected by using a sound collecting microphone 12. The detected sound is converted into an electric signal, which is amplified by an amplifier 13 and converted by an AD converter 14. Then the converted signal is stored in a microcomputer 15 to extract features of the sound, which are contrasted with a normal waveform which is stored previously. The vibration waveform is displayed on a CRT 17 through an image converting circuit 16 together with the result of said quality decision. The detection rod 11 is moved at the prescribed speed to detect connection defect positions as to all lead wires 5.