| 摘要 |
The solder material, for use with electronic components or similar, consists of a metal powder made from a eutectic mixt. of tin, lead and silver, a low-activity colophonium resin as flux, and a thermoplastic carboxylic acid binder of formula CnH2nO2, in which n is 14, 16, 18 or 20. The m.pt. of the binder is 50-75 deg.C and it evaporates at around 180 deg.C. - The compsn. is made by dissolving the flux in isopropanol and mixing with the metal powder. The binder is then added, the compsn. melted and mixed, and the solvent evaporated. (0/0)
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