| 摘要 |
<p>PURPOSE:To make it possible to obtain a good cleavage plane which is lineally cleaved, by forming a notch spaced by a length of a resonator of a semiconductor laser element on a scribe line in a direction vertical to a cleavage direction. CONSTITUTION:Each element 2 of a semiconductor laser is formed along a crystalline structure of a semiconductor wafer 1 and a notch 3 is formed at intervals of L of a resonator length of the element 2 on a scribe line l for cutting in a direction vertical to the cleavage plane of the element 2. Then, the wafer 1 having a notch 3 is fixed along the notch 3 in a direction forming the cleavage plane on end surfaces of vertical fixing tools 5 and 6. Then, a forced is applied to the wafer 1 downwardly and bar-shaped wafer 8 having a lineally cleaved plane 2a is formed using the notch 3 as a guide of the cleavage direction.</p> |
