| 摘要 |
<p>The invention relates to a drive mechanism for a wire bonding apparatus for large bonding regions, for connecting to bonding loci by means of wire bridges. The inventive drive mechanism is comprised of a drive motor (1) coupled to a first angle lever (2) and connected to a bonding head (9) via a bearing (8) in combination with a carrier piece (7), wherein said bonding head (9) is movable in the z-direction in a guide bushing (10). A second angle lever (14) guided by a mechism kinematically dsimilar to those for angle lever (2) is connected to a second drive motor (13) and couples the following three structures to the drive motor: an optical objective (32) vertically movable in a second guide bushing (29), a ratio device (27), and a sliding piece (24) which engages a lever (39) which lever is attached to the generator (12). With of this arrangement, and particularly with the second drive motor, automatic adjustment of the pivot point of the generator (12), of the objective (32), and of the radio device (27) is achieved. This arrangement thus enables compensation for even large variability in bonding planes.</p> |
