| 发明名称 |
RESIN COMPOSITION AND SOLDER RESIST RESIN COMPOSITION |
| 摘要 |
A resin composition or a solder resist resin composition which comprises (A) an epoxy resin and/or (B) epoxy acrylate obtained by reacting 1 chemical equivalent of the epoxy group of an epoxy resin with 0.1 to 1.0 chemical equivalent of acrylic acid, (C) a copolymer of styrene with maleic anhydride, (D) an unsaturated compound other than compound (B), and (E) a photopolymerization initiator. |
| 申请公布号 |
WO8905831(A1) |
申请公布日期 |
1989.06.29 |
| 申请号 |
WO1988JP01255 |
申请日期 |
1988.12.12 |
| 申请人 |
NIPPON KAYAKU KABUSHIKI KAISHA |
发明人 |
NAWATA, KAZUYOSHI;OKHUBO, TETSUO;YOKOSHIMA, MINORU |
| 分类号 |
C08F283/10;C08F299/02;C08G59/00;C08L25/08;C08L63/00;C08L63/10;H05K3/28;(IPC1-7):C08G59/40;G03C1/68;C09D11/10;C08G59/18;G03C1/727;C08G59/68 |
主分类号 |
C08F283/10 |
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