| 摘要 |
PURPOSE:To obtain a photosensitive resin compsn. having high safety and inexpensiveness, permitting development with aq. alkali, and formation of a highly reliable solder mask having high resolution and high heat resistance, by incorporating poly(p-vinyl phenol) or its deriv., an epoxy group-contg. unsatd. compd., a sensitizer and/or a sensitizing mixture into a photosensitive resin compsn. CONSTITUTION:The title photosensitive resin compsn. contains poly(p-vinyl phenol) or its deriv., and, as an essential component, an epoxy group-contg. unsatd. compd. obtd. by an addition reaction of triglycidyl isocyanurate with an epoxy group-contg. unsatd. monocarboxylic acid by regulating a value of the acid equivalent/epoxy equivalent to 0.3-0.9. Further, the compsn. contains a sensitizer and/or a sensitizing mixture which generates free radicals by the irradiation with active rays. Thus, a photosensitive resin compsn. having high safety and inexpensiveness, permitting development with aq. alkali and formation of a highly reliable solder mask having high resolution and high wet heat resistance to the soldering heat is obtd. |
