发明名称 PLATING TREATING DEVICE FOR PRINTED CIRCUIT BOARD
摘要 PURPOSE:To uniformly plate the inner wall of a small-diameter through-hole of a substrate by arranging a printed circuit board between driving belts having agitation fins for plating liquid, and rotating driving belts in the direction so that agitation direction of fins is made opposite in both side of the circuit board. CONSTITUTION:When right and left respective belts 1 to which fins 2 for agitating plating liquid are fitted in the opposite phases at the intervals of 1/2 of elongation of the driven belts 1 are actuated as shown in the arrows, pressure difference is generated in the right and left parts of a printed circuit board 19 by liquid flow and the liquid flow in a through-hole 20 is allowed to flow to left from right. When rotation of the belts 1 is progressed and A-A', B-B' are nearestly approached in the vicinity of the center of a treatment tank 21, halves of the fins 2 are made to the opposite phases and the liquid flow in the through-hole 20 is changed to right from left in the position made to the opposite phases and the liquid flow in the holes 20 near to A-A', B-B' is not allowed to flow to the constant direction while being subjected to turbulent flow. When the rotation of the belts 1 is furthermore progressed, the fins 2 act thoroughly in the opposite phases and the liquid flow in the hole 20 is allowed to flow to right from left and the liquid flow is circulated through the hole 20 by repeating a series action and thereby the inside of the hole 20 is uniformly plated.
申请公布号 JPH01165793(A) 申请公布日期 1989.06.29
申请号 JP19870324254 申请日期 1987.12.21
申请人 IBIDEN CO LTD 发明人 YONEZAWA NAOAKI
分类号 C25D21/10;C25D5/08;C25D7/00;H05K3/18;H05K3/42 主分类号 C25D21/10
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