| 摘要 |
In the fabrication of an integrated circuit package, leads 10 that carry an electrical signal from integrated circuits inside of the package to the outside are connected to conductors 70 inside the package prior to encapsulation in plastic. The conductors 70 are initially formed on a multilayer metal foil 40 by a photoresist method. The leads are soldered thereto at 75 and the package is placed in a mould 80. Thermoplastic is then injection moulded around the package and the metal foil 40 is finally removed from the package by etching. Integrated circuits may then be attached to the exposed conductors 70 within the package. <IMAGE> |
