| 摘要 |
<p>PURPOSE:To enable an accurate alignment to be made easily by locating an alignment system on the rear side of a substrate as well as providing an alignment mark on the surface of a substrate, and by detecting an alignment mark using light that penetrates a substrate and a sensitive material. CONSTITUTION:An image of a first alignment mark A' provided on an alignment substrate 3 by a projection lens 5 and a first alignment mark A provided on a mask 2 are observed at the same time by using a first alignment detector 7. A positional adjustment of the alignment substrate 3 in the horizontal plane is made using a substrate stage 6 so that both of them overlap. Next, this mark B is detected from the rear side of the substrate using a second alignment detector 8. The position of the alignment mark image produced on the receiving surface of a two-dimensional optoelectronic conversion element 12 is captured photo-electronically. Comparing the reference position stored with the position of the mark image captured at this point is made. The position of a substrate 4 is adjusted using the substrate stage 6 so that these match. Thus, the relationship of positions of the mask 1 and the substrate 4 is adjusted.</p> |
