| 发明名称 |
Thermoplastic resin composition containing mould release agents. |
| 摘要 |
<p>Thermoplastic molding composition comprising an organic polyester or poly(phenylene oxide) or poly(phenylene sulfide) or poly(etherimide) polysulfone and a hydrogenated oligomer of an alpha-olefin in an amount effective to impart reliable and facile mold release.</p> |
| 申请公布号 |
EP0321707(A2) |
申请公布日期 |
1989.06.28 |
| 申请号 |
EP19880119300 |
申请日期 |
1988.11.21 |
| 申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
NELSON, LINDA HARMON |
| 分类号 |
C08L67/02;B29C33/62;C08K5/01;C08L67/00;C08L71/12;C08L79/08;C08L81/00;C08L81/02;C08L81/06 |
主分类号 |
C08L67/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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