首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
摘要
申请公布号
JPH0197311(U)
申请公布日期
1989.06.28
申请号
JP19870193050U
申请日期
1987.12.18
申请人
发明人
分类号
A61B1/00;G02B23/26;(IPC1-7):G02B23/26
主分类号
A61B1/00
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Method of fabricating smooth seed layers with uniform crystalline texture for high perpendicular magnetic anisotropy materials
MRAM integration techniques for technology scaling
Composite substrate
Thermoelectric polymer composite, method of making and use of same
LED package and method of manufacturing the same
Light emitting device, light emitting device package and light emitting module
Light emitting device substrate with inclined sidewalls
Semiconductor light emitting device and method of manufacturing the same
Photovoltaic panel
Semiconductor structures and methods with high mobility and high energy bandgap materials
Semiconductor memory device having unequal pitch vertical channel transistors employed as selection transistors and method for programming the same
Imaging device and imaging system
Semiconductor device with a dislocation structure and method of forming the same
Voltage droop mitigation in 3D chip system
3D system-level packaging methods and structures
Residue free oxide etch
Circuit breaker including adjustable instantaneous trip level and methods of operating same
Electrical system and operating handle interface assembly therefor
Circuit breaker comprising at least one contact for tapping a voltage
Multilayer ceramic capacitor and board with the same mounted thereon