This invention provides an aluminum enamel board having an electrically insulating glass layer formed on an Al-Si alloy plate containing at least 5 wt % of Si or a composite metal plate having an aluminum or alloy layer formed on at least one side of a metal plate made of a metal other than aluminum. Since the Al-Si alloy plate containing at least 5 wt % of Si or a composite metal plate having the aluminum or aluminum alloy layer is used as a board, the adhesion strength between the metal plate and the electrically insulating glass layer can be increased. At the same time, a predetermined material is used to form the electrically insulating glass layer, thereby minimizing a difference in thermal conductivity and thermal expansion coefficient between the electrically insulating glass layer and the metal plate. This improves the heat conduction characteristics of the board and prevents warping of the board.
