发明名称 Alternate electrolytic/electroless-layered lid for electronics package
摘要 A lid or cover for a ceramic enclosure is formed of a substrate of an iron-based alloy, e.g., Kovar, alternately plated and coated with electrolytic nickel and electroless nickel, with an outer gold electroplate. The alternate electroplate and electroless nickel layers render the lid highly corrosion resistant without the need for an expensive, unrecoverable buried gold layer.
申请公布号 US4842961(A) 申请公布日期 1989.06.27
申请号 US19880164395 申请日期 1988.03.04
申请人 ADVANCED MATERIALS TECHNOLOGY CORP. 发明人 BASILE, THOMAS J.;LAPLANTE, JEAN
分类号 B32B15/01;H01L21/48 主分类号 B32B15/01
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