发明名称 Method for contactless testing for electrical opens and short circuits in conducting paths in a substrate
摘要 A method for contactlessly testing for opens and shorts in conducting paths within or on a nonconducting substrate. There are a plurality of conducting pads on the surface of the substrate. Charges are contactlessly generated, e.g., by an optical beam, in at least one selected pad inducing a voltage thereon and on pads electrically connected therewith through one of the conducting paths. A two dimensional electron flux is contactlessly caused to be emitted from the selected pad and at least one other pad of the plurality of pads, e.g., by an optical beam. The flux emitted from the pads depends on the voltage on each pad. The flux is detected to distinguish pads in electrical connection.
申请公布号 US4843329(A) 申请公布日期 1989.06.27
申请号 US19870107433 申请日期 1987.10.09
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BEHA, JOHANNES G.;BLACHA, ARMIN U.;CLAUBERG, ROLF;SEITZ, HUGO K.
分类号 H01L21/66;G01N23/22;G01R31/02;G01R31/308;H05K3/00 主分类号 H01L21/66
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