| 发明名称 |
Method for encapsulating electronic devices |
| 摘要 |
A method of encapsulating an electronic device on a substrate comprises depositing a radiatively curable barrier wall to contain a subsequently deposited encapsulant. Alternatively, an encapsulant comprising a majority of radiatively curable material is used in the absence of a barrier wall.
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| 申请公布号 |
US4843036(A) |
申请公布日期 |
1989.06.27 |
| 申请号 |
US19870067743 |
申请日期 |
1987.06.29 |
| 申请人 |
EASTMAN KODAK COMPANY |
发明人 |
SCHMIDT, JOHN D.;MAURINUS, MARTIN A. |
| 分类号 |
H01L21/56;H01L23/29;H01L23/31;H01L31/0203 |
主分类号 |
H01L21/56 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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