发明名称 SEALING METHOD FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To improve thermal shock resistance by making a sealing resin gel through the primary exposure of energy rays at a predetermined level and curing the resin through the secondary exposure of energy rays at a higher level. CONSTITUTION:The basic section of a LED is constituted in such a manner that a light-emitting element 1 is joined with a cathode lead 4 by a conductive material 2 such as solder, one of a connector wire 3 in Au, etc. is welded to the light-emitting element 1 through a thermocompression bonding method, etc., and the other is welded to an anode lead 5. The light-emitting element 1 is sealed with the resin in order to protect it from external environment, such as moisture, heat, vibration, a shock, etc. In this case, the sealing resin 6 is made gel through the primary exposure of energy rays of 30mW/cm<2> or less, and cured through the secondary exposure of energy rays of 70mW/cm<2> or more.
申请公布号 JPS58213457(A) 申请公布日期 1983.12.12
申请号 JP19820096447 申请日期 1982.06.04
申请人 MATSUSHITA DENKI SANGYO KK 发明人 KUDOU SHINICHI;HOUCHIN RIYUUZOU;MAEDA YUKIO
分类号 C09K3/10;C08G59/00;C08G59/68;H01L23/29;H01L23/31;H01L33/56;H01L33/62 主分类号 C09K3/10
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