发明名称 FORMING OF CHIP
摘要 PURPOSE:To eliminate uselessness of material to be filled into a mold by a method wherein a frame, having an opening, is inserted into a bottom force and a flexible lid is put on the opening of the frame while the frame is filled with the mixture of chips and binding agent and is pressed by a top force to bind them. CONSTITUTION:The frame 2 having an opening 21 on the upper part thereof is inserted into the bottom force 12 and is supported by pins 8. The flexible rid 4 is put on the opening 21 of the frame 2. The flexible lid 4 is consisting of an elastic material such as plastic sheet or the like. The bottom force 12 is filled with the mixture of chips and binding agent. The binding agent is cured to bind the chips when the mixture is pressed by the top force. The inside of the frame 2 in cushion body is shielded from the mixture 3 by the flexible lid 4 and a hollow section is maintained. The thickness of solidified layer of the chips becomes thinner than a conventional type by the thickness of the hollow section of the frame 2, however, the flexible lid 4 compensates it and, therefore, the cushioning property of the product is not different from the conventional type.
申请公布号 JPS61217222(A) 申请公布日期 1986.09.26
申请号 JP19850060500 申请日期 1985.03.25
申请人 IKEDA BUSSAN CO LTD 发明人 MIYAJI SHIGEHIRO
分类号 B29C43/18;B29C67/20;B29C70/68;B29C70/70 主分类号 B29C43/18
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