| 摘要 |
PURPOSE:To obtain a sealing material tablet which is of high density and possesses uniform density at the top and bottom even if the same is pressurized at low pressure, by a method wherein after the inside of a mold has been filled with a powdery or particulatelike sealer for electronic parts, molding is performed by pressurizing and compressing the upper part of the mold while applying a vibration of a pressurizing direction to the sealer. CONSTITUTION:The inside of a mold 1 is filled with epoxy resin powder 2 for sealing, which is pressurized from the upper part by a punch 3 connected with a hydraulic press. In this instance, compression molding is performed by applying predetermined surface pressure to the epoxy resin powder 2 while applying a vertical vibration to the punch 3. An obtained epoxy resin tablet is of high density and, moreover, the density becomes uniform at any part of the same in the direction of a thickness of the same. Then as molding can be performed by pressurizing at comparatively low pressure, a surface temperature of the mold is not raised so much and a crack is not generated on the tablet by sticking a sealer to the inner circumferential surface of the mold. |
