Adhesive compositions

摘要

The invention relates to adhesive compositions which can be processed at temperatures below 60@C and are based on at least two polyamide-forming components which are notable in that they have a DSC melting point of at least 100@C, a glass transition temperature of not more than 60@C measured by DSC on the dry powder, a softening point of at least 100@C in the dry state, and a softening point of below 100@C after being moistened and increasing in weight; after processing in the moist or moistened state, they have heat stabilities within the adhesive bond like those of high-performance hot-melt adhesives, of at least 110@C. These compositions exhibit high adhesion values and high heat stabilities, yet can be processed at low temperatures, in particular room temperature, without having to add environmentally polluting solvents or tackifying additives.