Method for positioning an electronic component on a substrate.

摘要

The invention relates to a method of positioning an electronic component and its connections on an identification card. According to the invention the electronic component (21) is first fixed to a metal layer (20) whilst its output terminals are connected electrically to specified locations of the layer. The resulting assembly is then fixed onto the identification card (30) so that the component (21) is accommodated inside a cavity (31). The metal layer (20) is then partitioned into electrically isolated contact zones (32), one per output terminal. The invention is applicable in particular to memory cards.