发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To effectively protect other circuits against a short-circuit damage by connecting a collector electrode to the lead electrode of a package by a conductor having smaller current capacity than that for connecting an emitter electrode to a corresponding lead electrode. CONSTITUTION:The lead frame 80 of a package 40 and a lead electrode 20 for a collector are cut and nonconductive, and connected by a bonding wire 9. When it is used as a switching power transistor 12 of a power switching circuit and broken down due to a short-circuit, since a collector electrode 5c is connected to the electrode 20 by a finer bonding wire 9 than that of an emitter bonding wire 7, the wire 9 of the collector is previously melted due to the short-circuit damage, and a base side is disconnected from a power source side at this time. Thereafter, a power source voltage is not directly applied to a switching driver 11 connected to the base. Accordingly, the driver 11 connected to the base can be effectively protected.
申请公布号 JPH01158741(A) 申请公布日期 1989.06.21
申请号 JP19870317016 申请日期 1987.12.15
申请人 TOKYO ELECTRIC CO LTD 发明人 NITTA NOBORU;HORI FUSAO
分类号 H01L21/60 主分类号 H01L21/60
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