| 摘要 |
PURPOSE:To provide the title film, having excellent soldering heat resistance, mechanical strength, etc., and useful for electronic and electric parts, etc., at a low cost, by biaxially orienting a composition comprising a polyetherether ketone and a polyarylene sulfide having >= a specific melt viscosity in a specified ratio therebetween. CONSTITUTION:The objective heat-resistant film is provided by biaxially orienting a composition comprising (A) 50-90 pts.wt. of a polyetherether ketone having the repeating units of the formula as a main component and (B) 10-50 pts.wt. of a straight chain polyarylene sulfide having a melt viscosity of >=1000 poises preferably in an orienting ratio of >=4.0 (area ratio) and subsequently heat-setting the oriented film at 250-350 deg.C. The heat-resistant film has excellent electrical characteristics, moisture resistance, flex resistance, transparency, etc., and can be stably melt-extruded from the composition to impart a good quality thereto. |
