| 摘要 |
PURPOSE:To use a small-sized inexpensive IC by forming an electrode formed on a substrate facing a power source terminal for supplying power to the IC of a connecting electrode formed on an IC chip, of at least one layer of metal film. CONSTITUTION:A metal electrode 10 is formed of a power source connector 12 on a glass substrate 1, an ITO electrode 2 is formed on the electrode 10, and connected to a power source electrode 11 formed on an IC chip 7 through an Au bump 4. An electrode 5 having no relation to the power source is connected by the bump 4 to the electrode 2 on the substrate 1, and the chip 7 is adhered by insulating resin 3 to the substrate 1. Accordingly, since the impedance of wirings can be reduced, the wirings can be densified even when a high current flows, an area necessary for a mounting unit can be minimized. Since the electrodes of the IC may be one per one wiring, a small-sized inexpensive IC can be utilized, thereby reducing the cost of a whole system. |
