Fabricating method of semiconductor device.

摘要

This invention relates to mounting of LSI chip (3 of multiple electrodes and narrow pitch such as gate array and microcomputer. In a semiconductor device having an LSI chip with bump electrode (36) affixed to a wiring board (32) by means of insulation resin (34), and the bump electrode of the LSI chip electrically connected by the contact between the wiring board and conductor wiring (30), by mounting with the bump electrode in a state of elastic deformation, both heat resistance and productivity are enhanced, and a semiconductor device of high reliability and low cost is obtained.