发明名称 Mechanism for connecting shielding caps of multi-pole plugs to the ground potential layers of a mother board
摘要 Spring elements are located at shielding caps of printed circuit board or cable connections such that they resiliently press against contact elements in the plugged condition, the contact elements being electrically connected to the ground potential layer of a mother board. Contact blades or reinforcing plates extending perpendicularly to the mother board serve as the contact elements. The spring elements, depending upon the position of the contact elements or the shape of the shielding caps are located at the insides or outsides of the shielding caps or are fashioned at the edges thereof which are directed towards the mother board.
申请公布号 US4840573(A) 申请公布日期 1989.06.20
申请号 US19880284788 申请日期 1988.12.12
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 SEIDEL, PETER;PELZL, LEO;ZELL, KARL
分类号 H01R12/16 主分类号 H01R12/16
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