发明名称 |
Mold release composition |
摘要 |
A process for imparting releasing property to a mold which comprises applying to the mold a composition comprising: (A) (1) a fluorine-containing urethane compound represented by the formula <IMAGE> (I) and/or (2) a fluorine-containing urethane compound represented by the formula <IMAGE> (II) and/or (3) a fluorine-containing urethane compound represented by the formula <IMAGE> (III) and (B) at least one of members selected from the class consisting of silicone oil, silicone varnish, wax and a highly fluorinated organic compound and the mold release composition used for the process.
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申请公布号 |
US4840675(A) |
申请公布日期 |
1989.06.20 |
申请号 |
US19880249191 |
申请日期 |
1988.09.26 |
申请人 |
DAIKIN KOGYO CO., LTD. |
发明人 |
FUKUI, SHOSIN;SHINJO, MASAYOSHI;AOYAMA, HIROKAZU |
分类号 |
B29C33/00;B29B13/00;B29C33/60;B29C33/64;C08G18/00;C08G18/30;C08G18/38;C10M105/56;C10M105/72;C10M111/00;C10M133/00;C10N40/36;C10N50/02 |
主分类号 |
B29C33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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