| 摘要 |
<p>PURPOSE:To reduce a potential of an electrode on the rear side of an IC chip and a potential of a prescribed electrode on its surface side to the same poten tial easily by a method wherein a through hole is made in a lead support part and one part of an outer lead part of a lead terminal faces the rear side of a tape base material as a potential extraction part via the through hole. CONSTITUTION:In a tape carrier, a through hole 10 piercing a tape base mate rial 1 from its surface to its rear is made in a lead support part 5 corresponding to an outer lead part 6b of a lead terminal 6. One part of the outer lead part 6b branches and faces the rear side of the tape base material 1 as a potential extraction part 6c via the through hole 10. The potential extraction part 6c facing the rear side of the tape base material 1 is connected, by a pressure bonding operation, a soldering operation or the like, to an end part 11b of an IC chip bonding stage 11 connected to a rear-side electrode of an IC chip 7 by using a conductive bonding material.</p> |
