| 摘要 |
PURPOSE:To enable a semiconductor wafer to be screened as it is by means of providing an input pad for commanding test mode setting. CONSTITUTION:A power supply 14 is connected to a power supply pad 11 by mounting a semiconductor wafer 12 on an electrode plate 13. When a pad 15 for commanding test mode setting is impressed with a negative voltage using a jig 16, a transistor 171 on a test mode throwing circuit 17 is turned on. Then, the level of an output signal line 172 from said circuit 17 is lowered to set up a burn-in mode; an input.output processing circuit 19 is actuated; a clock signal is transmitted by an oscillating circuit 21 to be inputted in an inner circuit (a). Thus, respective clips are screened before they are packaged.
|
