发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent the generation of a short-circuit by a method wherein the peripheral parts of an insulative sheet, which is placed and fixed on leads, are formed thicker than the central part of the sheet to prevent wires from coming into contact with a pellet. CONSTITUTION:An insulative sheet 2 is fixed in the almost central part between leads 1 in such a way that the sheet 2 is supported by the leads 1 and after a pellet 3 is die bonded on the sheet 2, a wire bonding is performed to connect the pellet 3 with inner leads 1b of the leads 1 by wires 4. The peripheral parts 2a of the sheet 2 are bent upward and the wires 4 are wired in contact to the peripheral parts 2a or in such a way as to pass slightly over the peripheral parts. Whereupon, even though the sagging of the wires 4 due to the sag and the deformation of the wires 4 is generated at the time of the wire bonding to be performed after the pellet 3 is mounted in the central part, the wires 4 are prevented from coming into contact with the pellet 3. Thereby, the generation of a short-circuit is prevented.
申请公布号 JPH01155644(A) 申请公布日期 1989.06.19
申请号 JP19870313672 申请日期 1987.12.11
申请人 TOSHIBA CORP 发明人 ICHIKAWA KEIJI;ONO JUNICHI
分类号 H01L23/28;H01L21/60;H01L23/16;H01L23/495;H01L23/50 主分类号 H01L23/28
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